Conference

A. C. Scogna, C.-D. Wang, A. Orlandi, and T.-L. Wu, “Parallel-plate noise suppression using a ground surface perturbation lattice (GSPL) structure,” in Asia-Pacific Symp. Electromagn. Compat., pp. 158-161, Beijing, China, Apr. 2010

H.-H. Chuang, C.-J. Hsu, M.-Z. Hong, D. Hsu, R. Huang, L.-C. Hsiao, and T.-L. Wu, “Signal/power integrity design strategy for low-cost package of high-speed memory I/O interfaces,” in Proc. IEEE Electron. Design Adv. Packag. Systems Symp., pp. 1-4, Hong Kong, China, Dec. 2009

C.-H. Tsai and T.-L. Wu, “A GHz common-mode filter using negative permittivity metamaterial on low temperature co-fire ceramic (LTCC) substrate,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 91-94, Austin, USA, Aug. 2009

C.-H. Tsai and T.-L. Wu, “A metamaterial-typed differential transmission line with broadband common-mode suppression,” in Proc. IEEE Int. Symp. Electromagn. Compat. Eur. Workshop, Jun. 2009

H.-H. Chuang, T.-L. Wu, and T.-K. Wang, “Parallel-plate noise isolation using a macro-via photonic crystal structure in advanced package,” in Asia-Pacific Microw. Conf., Hong Kong, Dec. 2008

H.-H. Chuang, S.-J. Wu, M.-Z. Hong, D. Hsu, R. Huang, and T.-L. Wu, “Power integrity chip-package-PCB co-Simulation for I/O interface of DDR3 high-speed memory,” in Proc. Elect. Design Adv. Packag. Systems Symp., pp. 31-34, Seoul, Dec. 2008

C.-Y. Hsieh, H.-H. Chuang, T.-K. Wang, C.-C. Wang, H.-H. Cheng, Y.-S. Wu, C.-T. Chiu, C.-P. Hung, and T.-L. Wu, “A novel stopband-enhanced EBG planes using an embedded slow-wave structure,” in Proc. Elect. Performance Electron. Packag. Systems, pp. 131-133, Oct. 2008

S.-J. Wu, H.-H. Chuang, T.-K. Wang, and T.-L. Wu, “A novel HU-shaped common-mode filter for GHz differential signals,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 1-4, Aug. 2008

C.-H. Shih, G.-H. Shiue, T.-L. Wu, and R.-B. Wu, “The effects on SI and EMI for differential coupled microstrip lines over LPC-EBG power/ground planes,” in Asia-Pacific Symp. Electromagn. Compat., pp. 164-167, Singapore, May 2008

T.-K. Wang, T.-W. Han, and T.-L. Wu, “A novel EBG power plane with stopband enhancement using artificial substrate,” in Proc. Elect. Performance Electron. Packag. Systems, pp. 193-196, Atlanta, Georgia, USA, Aug. 2007

Y.-C. Chen, T.-K. Wang, S.-M. Lan, C.-H. Lu, and T.-L. Wu, “Broadband noise suppression using a hybrid photonic crystal power/ground plane substrate,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 1-4, Honolulu, Hawaii, USA, Jul. 2007

Tzong-Lin Wu, “Power Integrity and EMC Design for High-speed Computer Packages,” 5th International Symposium on Electromagnetic Environment Technology, Seoul, Korea, June, 2007. (**Keynote speaker**)

H.-C. Kuo, S.-T. Chen, and T.-L. Wu, “Improving the radiated immunity of the strip-lines using a novel hybrid EBG structure,” in Proc. IEEE Elect. Performance Electron. Package. Systems, pp. 223-236, Oct. 2006

S. Sun, D. Pommerenke, J. Drewniak,K. Xiao,S.-T. Chen, and T.-L. Wu, “Characterizing package/PCB PDN interactions from a full-wave finite-difference formulation,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 550-555, Portland, Oregon, USA, Aug. 2006

H.-J. Ou, T.-S. Horng, and T.-L. Wu, “Power splitting analysis of 3×3 photonic crystal ,” Optoelectron. Commun. Conf., Southem Taiwan Opto-Electronics Center of Excellence National Su, Jul. 2006

S. T. Chen, T. S. Horng, T. L. Wu, “Photonic Crystal Power Substrate for Wideband Suppression of Power/Ground Bounce Noise and Radiated Emission in High-speed Packages,” 2005 Asia Pacific Symposium on EMC (Best Student Paper Award), Vol. 1, pp. 498 – 500, Taipei, Taiwan, Dec. 2005

H. C. Kuo, S. T. Chen, C. C. Wang, S. W. Wen, H. C. Li, C. C. Chien, T. L. Wu, “High electromagnetic immunity power/ground planes using L-bridged electromagnetic bandgap (EBG) structure,” 2005 Asia Pacific Symposium on EMC, Vol. 1, pp. 117 – 120, Taipei, Taiwan, Dec. 2005

J. S. Chiang and T. L. Wu, “Polarization Beam Splitting in Twin- Elliptical-Core Photonic Crystal Fiber Coupler,” The 8th International Symposium on Communications (ISCOM 2005), Kaohsiung, Taiwan, Nov. 2005

H. J. Ou, T. S. Horng and T. L. Wu, “A modified FDTD procedure for computing the electromagnetic bandgap (EBG) structure,” 2005 International Conference on Electromagnetic Applications and Compatibility, Taipei, Taiwan, Oct. 2005

T. K. Wang, C. C. Wang, S. T. Chen, Y. H. Lin, T. L. Wu, “A new frequency selective surface power plane with broad band rejection for simultaneous switching noise on high-speed printed circuit boards,” 2005 IEEE EMC Symposium, pp. 917 – 920, Chicago, USA, Aug. 2005