Conference

S. T. Chen, T. S. Horng, T. L. Wu, “Photonic Crystal Power Substrate for Wideband Suppression of Power/Ground Bounce Noise and Radiated Emission in High-speed Packages,” 2005 Asia Pacific Symposium on EMC (Best Student Paper Award), Vol. 1, pp. 498 – 500, Taipei, Taiwan, Dec. 2005

H. C. Kuo, S. T. Chen, C. C. Wang, S. W. Wen, H. C. Li, C. C. Chien, T. L. Wu, “High electromagnetic immunity power/ground planes using L-bridged electromagnetic bandgap (EBG) structure,” 2005 Asia Pacific Symposium on EMC, Vol. 1, pp. 117 – 120, Taipei, Taiwan, Dec. 2005

J. S. Chiang and T. L. Wu, “Polarization Beam Splitting in Twin- Elliptical-Core Photonic Crystal Fiber Coupler,” The 8th International Symposium on Communications (ISCOM 2005), Kaohsiung, Taiwan, Nov. 2005

H. J. Ou, T. S. Horng and T. L. Wu, “A modified FDTD procedure for computing the electromagnetic bandgap (EBG) structure,” 2005 International Conference on Electromagnetic Applications and Compatibility, Taipei, Taiwan, Oct. 2005

T. K. Wang, C. C. Wang, S. T. Chen, Y. H. Lin, T. L. Wu, “A new frequency selective surface power plane with broad band rejection for simultaneous switching noise on high-speed printed circuit boards,” 2005 IEEE EMC Symposium, pp. 917 – 920, Chicago, USA, Aug. 2005

H. J. Ou, T. L. Wu, “Analysis and solution of modes loss problem for computing the bandgap structure of periodic structures by 2-D FDTD method,” International Conference ATENNAS, RADAR, AND WAVE PROPAGATION (IASTED), Banff, Alberta, Canada, Jul. 2005

Chien-Chung Wang; Sung-Mao Wu; Chia-Hsing Chou; Chih-Wei Tsai; Ting-Kuang Wang; Yen-Hui Lin; Sin-Ting Chen; Tzong-Lin Wu;, “A Novel Embedded Power Plane with 10GHz Stopband for Simultaneous Switching Noise,” Electronic Components and Technology, 2005. ECTC '05, Page(s):769 - 771, Orlando, Jun. 2005

Ting-Kuang Wang, Chien-Chung Wang, Yen-Hui Lin, and Tzong-Lin Wu, “A New Electromagnetic Bandgap Power Plane with super-broadband suppression of Ground Bounce Noise in High Speed Circuits,” International Conference in Electromagnetic Application and Compatibility (ICEMAC 2004), Taipei, Oct. 2004

Sin-Ting Chen, Chih-Wei Tsai, Sung-Mao Wu, Chih-Pin Hung, Tzong-Lin Wu, “Chip-level Model of Switching Noise Coupling on Integrated System Combining Package and Printed Circuit Board,” EMC Europe 2004,, Vol. 1, pp. 420-424, Eindhoven, Netherland, Sept. 2004

Yen-Hui Lin and Tzong-Lin Wu, “Analysis of Radiation Caused by SSN and Transmission Line by Combining the Equivalent Circuits of Active IC into FDTD,” 2004 IEEE EMC Symposium, pp. 277-282, Santa Clara,USA, Aug. 2004

Tzong-Lin Wu, Wen-Chi Hung, Chien-Hui Lee, Cheng-Wei Lin, Wern-Shiarng Jou and Wood-Hi Cheng,, “A low-cost plastic package for 2.5Gbps optical transceiver module with high electromagnetic shielding,” Electronic Components and Technology (ECTC), Vol. 1, pp. 199-202, Jun. 2004

Jung-Sheng Chiang and Tzong-Lin Wu, “A novel periodic structures in photonic crystal fibers,,” The 5th Pacific Rim Conference Lasers and Electro-Optics(CLEO/PR2003), Vol. 1, pp. 17, Taipei, Dec. 2003

Chia-Hsin Chao and Tzong-Lin Wu, “Photonic Crystal Fiber Analysis Through Vector Boundary-Element Method,” The 5th Pacific Rim Conference Lasers and Electro-Optics(CLEO/PR2003), Vol. 2, pp. 100, Taipei, Dec. 2003

Chia-Hsin Chao and Tzong-Lin Wu, “Polarization and Dispersion Analysis of Holey Fibers with Elliptical Air Holes through the Vector Boundary-Element Method,” 16th Annual Lasers and Electro Optics Society Meeting(LEOS 2003), Vol. 2, pp. 900-902, Tucson, USA, Oct. 2003

Sin-Ting Chen, Chih-Wei Tsai, Sung-Mao Wu, Chih-Pin Hung and Tzong-Lin Wu, “Coupling Effect of Ground Bounce Noise for Ball Grid Array (BGA) package mounted on Printed Circuit Boards (PCB),” 2003 Taiwan EMC Conference, Vol. 1, pp. 64-68, Oct. 2003

W.-H. Cheng, T.-L. Wu and W.-S. Jou, “Electromagnetic Shielding of Plastic Packaging in Cost-Effective Optical Transceiver Modules,” 16th Annual Lasers and Electro Optics Society Meeting(LEOS 2003), Vol. 2, pp. 565-566, Tucson, USA, Oct. 2003

Chun-Chin Kuo and Tzong-Lin Wu,, “ Time-Domain SPICE Model for Coupled Interconnects Using the Multi-Conductor Layer Peeling Technique,” 15th Internation Zurich Symposium & Techncal Exhibition on EMC 2003, Vol. 1, pp. 5-10, Feb. 2003

Hsiao-Chen Chang and Chun-Chin Kuo and Tzong-Lin Wu, “A time-domain approach to extract SPICE-compatible equivalent models for embedded interconnects,” 2002 IEEE EMC Symposium, Vol. 2, pp. 834 -839, ,Minnesota,USA, Aug. 2002

Li-Rung Chen and Yen-Hui Lin and Tzong-Lin Wu, “NSTL evaluation of the compact EMC chamber with ferrite tiles being partially lined on the floor ground,” 2002 IEEE EMC Symposium, Vol. 2, pp. 958 -963, Minnesota,USA, Aug. 2002

Jiunn-Nan Hwang and Tzong-Lin Wu, “Coupling of the ground bounce noise to the signal trace with via transition in partitioned power bus of PCB,” 2002 IEEE EMC Symposium, Vol. 2, pp. 733 -736, Minnesota,USA, Aug. 2002