C.-D. Wang and T.-L. Wu, “Model and mechanism of miniaturized and stopband-enhanced interleaved EBG structure for power/ground noise suppression,” IEEE Trans. Electromag. Compat., vol. 55, no. 1, pp. 159 - 167, Feb. 2013.
DownloadC.-H. Huang and T.-L. Wu, "Analytical Design of Via Lattice for Ground Planes Noise Suppression and Application on Embedded Planar EBG Structures,"IEEE Trans. Compon. Packag. Manuf. Technol., vol. 3, no. 1, pp. 21-30, Jan. 2013
DownloadJ.-C. Yen, S.-K. Hsu, T.-H. Lin, and T.-L. Wu, “A Broadband Forward-Wave Directional Coupler Using Periodic Y-Shaped Ground Via Structures With Arbitrary Coupling Levels,” IEEE Trans. Microw. Theory Techn., vol.61, no.1, pp. 38-47, Jan. 2013.
DownloadC.-Y. Hsiao, C.-H. Tsai, C.-N. Chiu, T.-L. Wu, "Radiation Suppression for Cable-Attached Packages Utilizing a Compact Embedded Common-Mode Filter",IEEE Trans. Compon. Packag. Manuf. Technol., vol. 2, no. 10, pp. 1696-1703, Oct. 2012.
DownloadH.-H. Chuang, C.-C. Chou, Y.-J. Chang, and T.-L. Wu, "A branched reflector technique to reduce crosstalk between slot-crossing signal lines," IEEE Trans. Microw. Compon. Lett., vol. 22, no. 7, pp. 342 - 344, Jul. 2012
DownloadH.-C. Chen, C.-H. Tsai, and T.-L. Wu, "A compact and embedded balanced bandpass filter with wideband common-mode suppression on wireless SiP," IEEE Trans. Compon. Packag. Manuf. Technol., vol. 2, no. 6, pp. 1030-1038, Jun. 2012
DownloadT.-Y. Cheng, C.-D. Wang, Y.-P. Chiou, and T.-L. Wu, "A new macro-π model for through-silicon vias on 3-D IC using conformal mapping method," IEEE Trans. Microw. Compon. Lett., vol. 22, no. 6, pp. 303 - 305, Jun. 2012
DownloadC.-D. Wang, Y.-M. Yu, F. d. Paulis, A. C. Scogna, A. Orlandi, Y.-P. Chiou, and T.-L. Wu, “Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 2, no. 2, pp. 332-341, Feb. 2012
DownloadC.-H. Tsai, I.-I. A. Ieong, H.-C. Chen, and T.-L. Wu, “A miniaturized and broadband balun using artificial couopled line with imaginary even-mode impedance,” IEEE Trans. Microw. Theory Techn., vol. 59, no. 9, pp. 2233-2240, Sept. 2011
DownloadH.-H. Chuang and T.-L. Wu, “Suppression of common-mode radiation and mode-conversion for slot-crossing GHz differential signals using novel grounded resonators,” IEEE Trans. Electromagn. Compat., vol. 53, no. 2, pp. 429-436, May 2011
DownloadS.-K. Hsu, J.-C. Yen, and T.-L. Wu, “A novel compact forward-wave directional coupler design using periodical patterned ground structure,” IEEE Trans. Microw. Theory Techn., vol. 59, no 5, pp. 1249-1257, May 2011
DownloadH. H. Chuang and T. L. Wu, “A novel ground resonator technique to reduce common-mode radiation on slot-crossing differential signals,” IEEE Trans. Microw. Compon. Lett., vol. 20, no. 12, pp. 660 - 662, Dec. 2010
DownloadC.-H. Cheng, C.-H. Tsai, and T.-L. Wu, “A novel time domain method to extract equivalent circuit model of patterned ground structures,” IEEE Trans. Microw. Compon. Lett., vol. 20, no. 9, pp. 486-488, Oct. 2010
DownloadC.-Y. Hsieh, C.-D. Wang, K.-Y. Lin, and T.-L. Wu, “A power bus with multiple via ground surface perturbation lattices for broadband noise isolation: modeling and application in RF-SiP,” IEEE Trans. Adv. Packag., vol. 33, no. 3, pp. 582-591, Aug. 2010
DownloadS.-K. Hsu, C.-H. Tsai, and T.-L. Wu, “A novel miniaturized forward-wave directional coupler with periodical mushroom-shaped ground plane,” IEEE Trans. Microw. Theory Techn., vol. 58, no. 8, pp. 2277-2283, Aug. 2010
DownloadT.-L. Wu, J. Fan, F. d. Paulis, C.-D. Wang, A. C. Scogna, and A. Orlandi, “Mitigation of noise coupling in multilayer high-speed PCB: state of the art modeling methodology and EBG technology,” IEICE Trans. Commun. (Invited paper), vol .E93-B, no. 07, Jul. 2010
DownloadA. Ciccomancini, T. L. Wu, and A. Orlandi, “Noise coupling mitigation in PWR/GND plane pair by means of photonic crystal fence: sensitivity analysis and design parameters extraction,” IEEE Trans. Adv. Packag., vol. 33, no. 3, pp. 574-581, May 2010
DownloadW.-Y. Huang, T.-K. Wang, and T.-L. Wu, “Design and modelling of miniaturized bandgap structure for wideband GHz-noise suppression based on LTCC technology,” IEEE Trans. Adv. Packag., vol. 33, no. 3, pp. 630-638, May 2010
DownloadT.-L. Wu, H.-H. Chuang, and T.-K. Wang, “Overview of power integrity solutions on package and PCB: decoupling and EBG isolation,” IEEE Trans. Electromagn. Compat. (Invited paper), vol. 52, no. 2, pp. 346-356, May 2010
DownloadH.-H. Chuang, W.-D. Guo, Y.-H. Lin, H.-S. Chen, Y-C Lu, J. Hong, C.-H. Yu, A. Cheng, J. Chou, C.-J. Chang, J. Ku, T.-L. Wu, and R.-B. Wu, “Signal/Power integrity modeling of high-speed memory modules using chip-package-board co-analysis,” IEEE Trans. Electronmagn. Compat., vol. 52, no. 2, pp. 381-391, May 2010
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