Publications

Y.-M. Yu, C.-N. Chiu, Y.-P. Chiou, T.-L. Wu, “A Novel 2.5-Dimensional Ultraminiaturized-Element Frequency Selective Surface,” IEEE Trans. Antennas Propag., vol.62, no.7, pp. 3657-3663, July. 2014.

C.-K. Shen, T.-L. Wu, C.-H. Chen, and D.-H. Han, “Miniaturized and bandwidth-enhanced multilayer 1-D EBG structure for power noise suppression,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 357-361, Rayleigh, USA, Aug. 2014

C.-H. Cheng, T.-Y. Cheng, C.-H. Du, Y.-C. Lu, Y.-P. Chiou, Sally Liu, T.-L. Wu, “An Equation-Based Circuit Model and its Generation Tool for 3-D IC Power Delivery Networks with an Emphasis on Coupling Effect,” IEEE Trans. Compon. Packag. Manuf. Technol., vol.4, no.6, pp. 1062-1070, June. 2014.

C.-Y. Hsiao and T.- L. Wu, "A novel dual-function circuit combining high-speed differential equalizer and common-mode filter with an additional zero," IEEE Trans. Microw. Compon. Lett., vol. 24, no. 9, pp. 617-619 Sept. 2014

S.-Y. Hsu, C.-C. Chou, and T.-L. Wu, "Signal Integrity: Influence of Non-linear Driver,Different Bit Rates, and Estimation by Different Algorithms," in International Symp. Electromagn. Compat., Tokyo, May 2014.

J.-H. Chou, J.-F. Chang, D.-B Lin, H.-J. Li, T.-L. Wu, "A Compact Loop-Slot Mode Combination Antenna for Ultra-thin Tablet Computer with Metallic Bottom Cover," IEEE Antennas Wireless Propag. Lett., vol.13, pp. 746-749, Apr. 2014.

C.-Y. Hsiao, S.-H. Wang, C.-C Wang, W.-S. Wang, Y.-H. Lin,and T.-L. Wu, "Radio-Frequency Interference Mitigation Strategies for High-Speed Connectors," in Proc. Elect. Design Adv. Packag. Systems Symp., pp. 1-4, Nara, Japan, Dec. 2013

C.-H. Cheng and T.-L. Wu, “A novel common-mode filter for multiple differential pairs with low crosstalk and low mode conversion level” in Proc. Elect. Performance Electron. Package. Systems, San Jose, USA, Oct, 2013, pp.259-262.

H.-C. Chen, S. Connor, T.-L. Wu, and B. Archambeault, “The effect of various skew compensation strategies on mode conversion and radiation from high-speed connectors,” in Proc. IEEE Int. Symp. Electromagn. Compat., Denver, USA, Aug. 5-9, 2013, pp. 328–332.

Y.-C. Tseng, P.-S. Chen, W.-C. Lo, S.-H. Wu, and T.-L. Wu, “Compact TSV-based wideband bandpass filters on 3-D IC,” in Proc. IEEE 63rd Electronic Components and Technology Conf., Nevada, USA, May 28-31, 2013, pp. 2083-2088.

T.-H. Lin, S.-K. Hsu, and T.-L. Wu, “Bandwidth enhancement of 4 x 4 butler matrix using broadband forward-wave directional coupler and phase difference compensation,” IEEE Trans. Microw. Theory Techn., vol.61, no.12, pp. 4099-4109, Dec. 2013.

H.-H. Chuang, G.-H. Li, E. Song, H.-H. Park, H.-T. Jang, H.-B. Park, Y.-J. Zhang, D. Pommerenke, T.-L. Wu, and J. Fan, “A magnetic-field resonant probe with enhanced sensitivity for RF interference applications,” IEEE Trans. Electromag. Compat., vol.55, no.6, pp. 991-998, Dec. 2013.

C.-D. Wang, Y.-J. Chang, Y.-C. Lu, P.-S. Chen, W.-C. Lo, Y.-P. Chiou, and T.-L. Wu, “ABF-based TSV arrays with improved signal integrity on 3-D IC/interposers: equivalent models and experiments,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 3, no. 10, pp. 1744-1753, Oct. 2013

Y.-J. Cheng, H.-H. Chuang, C.-K. Cheng, and T.-L. Wu, “Novel differential-mode equalizer with broadband common-mode filtering for Gb/s differential-signal transmission,” IEEE Trans. Compon. Packag. Manuf. Technol.,vol. 3, no. 9, pp. 1578-1587, Sep. 2013

T.-L. Wu, F. Buesink, and F. Canavero, “Overview of signal integrity and EMC design technologies on PCB:fundamentals and latest progress,” IEEE Trans. Electromag. Compat., vol. 55, no. 4, pp. 624 - 638, Aug. 2013.

C.-K. Shen, Y.-C. Lu, Y.-P. Chiou, T.-Y. Cheng, and T.-L. Wu, “Power distribution network modeling for 3-D ICs with TSV arrays,” 18th Asia and South Pacific Design Automation Conference (ASP-DAC), pp. 17-22, Yokohama, Japan, Jan. 2013.

T.-H. Lin, J.-C. Yen, S.-K. Hsu, and T.-L. Wu, “A novel compact 3-dB forward-wave directional coupler with periodic capacitive enhancement,” in Proc. Asia-Pacific Microw. Conf., pp. 983-985, Kaohsiung, Taiwan, Dec. 2012.

J.-H. Lin, H.-P. Chang, T.-L. Wu, and Y.-P. Chiou, “3D simulation of substrate noise coupling from Through Silicon Via (TSV) and noise isolation methods,” in Proc. IEEE Elect. Design Adv. Packag. Systems Symp., pp. 181-184, Taipei, Taiwan, Dec. 2012.

K.-Y. Chen, Y.-A. Sheu, C.-H. Cheng, J.-H. Lin, Y.-P. Chiou, and T.-L. Wu, “A novel TSV model considering nonlinear MOS effect for transient analysis,” in Proc. IEEE Elect. Design Adv. Packag. Systems Symp., pp. 49-52, Taipei, Taiwan, Dec. 2012.

Y.-C. Tseng, C.-B. Chang, C.-K. Tang, C.-H. Cheng, Y.-C. Lu, K.-Y. Lin, T.-L. Wu, and R.-B. Wu, “Design considerations for radio frequency 3DICs,” in Proc. IEEE Elect. Design Adv. Packag. Systems Symp., 2012 IEEE, pp.197-200, Dec. 2012.