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Electro Magnetic Compatibility » Research

Research

Total 6 Posts Pages 1 - 1

Signal & Power Integrity Design in 3DIC

Due to the physical constrain, the miniaturization technique of the transistors manufacture is approaching its limit. To keep Moore’s law, three-dimensional integrated circuit (3-D IC) technology...

by 2012-02-23 瀏覽 12040

Near-Field Magnetic Probe

As the complexity of hardware architecture keeps increasing in recent decades, the identifications of noise sources become more challenging. Meanwhile, due to the decreasing of the operating voltage..

by 2012-02-23 瀏覽 8505

Miniaturized Microwave Circuits

The communication technology has a great progress in decade, and these changes make our life more comfortable and convenient. In order to invent more powerful products and lower down the cost, the cha

by 2010-10-13 瀏覽 9422

Signal Integrity Design on PCB, Package, and Chip Level

With the trend of high data rate transmission, differential signaling has become essential in high-speed digital system design due to its high immunity to noise and crosstalk and low EMI.

by 2010-10-05 瀏覽 9687

Electromagnetic Interference & Radio-Frequency Interference (EMI & RFI) Suppression on PCB and Package Level

In order to satisfy the high demand of low cost and size reduction, chips, including digital and analog integrated circuits (ICs), must be integrated in the same package or printed circuit board (PCB)

by 2010-08-11 瀏覽 15918

Power Integrity on PCB, Package, and Chip Level

Power distribution network (PDN) design has became one of the major concerns in designing high-speed circuits or mixed signal systems in recent few years.

by 2010-07-07 瀏覽 12931
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