EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis, synthesis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and CAD/design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society. Authors are invited to submit papers describing new technical contributions related to the broad area of electrical performance of high-performance interconnect systems, covering: 1.Emerging and advanced issues, 2.New design techniques and innovative architectures 3.Novel CAD concepts, methodologies and algorithms for modeling, simulation and optimization.
