Publications

H.-H. Chuang, C.-J. Hsu, J. Hong, C.-H. Yu, A. Cheng, J. Ku, and T.-L. Wu, “A broadband chip-level power-bus model feasible for power integrity chip-package co-design in high-speed memory circuits,” IEEE Trans. Electromagn. Compat., vol. 52, no. 1, pp. 235-239, Feb. 2010

G.-Z. Wu, Y.-C. Chen, and T.-L. Wu, “Design and implementation of a novel hybrid photonic crystal power/ground layer for broadband power noise suppression,” IEEE Trans. Adv. Packag., vol. 33, no. 1, pp. 206-211, Feb. 2010

C.-H. Tsai and T.-L. Wu, “A broadband and miniaturized common-mode filter for gigahertz differential signals based on negative permittivity metamaterials,” IEEE Trans. Microw. Theory Techn., vol. 58, no. 1, pp. 195-202, Jan. 2010

H.-H. Chuang, C.-J. Hsu, M.-Z. Hong, D. Hsu, R. Huang, L.-C. Hsiao, and T.-L. Wu, “Signal/power integrity design strategy for low-cost package of high-speed memory I/O interfaces,” in Proc. IEEE Electron. Design Adv. Packag. Systems Symp., pp. 1-4, Hong Kong, China, Dec. 2009

T.-K. Wang, C.-Y. Hsieh, H.-H. Chuang, and T. L. Wu, “Design and modeling of a stopband-enhanced EBG structure using ground surface perturbation lattice for power/ground noise suppression,” IEEE Trans. Microw. Theory Techn., vol. 57, no. 8, pp. 2047-2054, Aug. 2009

C.-H. Tsai and T.-L. Wu, “A GHz common-mode filter using negative permittivity metamaterial on low temperature co-fire ceramic (LTCC) substrate,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 91-94, Austin, USA, Aug. 2009

C.-H. Tsai and T.-L. Wu, “A metamaterial-typed differential transmission line with broadband common-mode suppression,” in Proc. IEEE Int. Symp. Electromagn. Compat. Eur. Workshop, Athens, Greece, Jun. 2009

S.-J. Wu, C.-H, Tsai, T.-L. Wu, and T.-Itoh, “A novel wideband common-mode suppression filter for GHz differential signals using coupled patterned ground structure,” IEEE Trans. Microw. Theory Techn., vol. 57, no.4, pp. 848-855, Apr. 2009

H.-H. Chuang, T.-L. Wu, and T.-K. Wang, “Parallel-plate noise isolation using a macro-via photonic crystal structure in advanced package,” in Asia-Pacific Microw. Conf., Hong Kong, Dec. 2008

H.-H. Chuang, S.-J. Wu, M.-Z. Hong, D. Hsu, R. Huang, and T.-L. Wu, “Power integrity chip-package-PCB co-Simulation for I/O interface of DDR3 high-speed memory,” in Proc. Elect. Design Adv. Packag. Systems Symp., pp. 31-34, Seoul, Dec. 2008

C.-Y. Hsieh, H.-H. Chuang, T.-K. Wang, C.-C. Wang, H.-H. Cheng, Y.-S. Wu, C.-T. Chiu, C.-P. Hung, and T.-L. Wu, “A novel stopband-enhanced EBG planes using an embedded slow-wave structure,” in Proc. Elect. Performance Electron. Packag. Systems, San Jose, CA, USA, pp. 131-133, Oct. 2008

S.-J. Wu, H.-H. Chuang, T.-K. Wang, and T.-L. Wu, “A novel HU-shaped common-mode filter for GHz differential signals,” in Proc. IEEE Int. Symp. Electromagn. Compat., Detroit, MI, USA, pp. 1-4, Aug. 2008

T.-K. Wang, T.-W. Han, and T.-L. Wu, “A novel power/ground layer using artificial substrate EBG for simultaneously switching noise suppression,” IEEE Trans. Microw. Theory Techn., vol. 56, no. 5, pp. 1164-1171, May 2008

C.-H. Shih, G.-H. Shiue, T.-L. Wu, and R.-B. Wu, “The effects on SI and EMI for differential coupled microstrip lines over LPC-EBG power/ground planes,” in Asia-Pacific Symp. Electromagn. Compat., pp. 164-167, Singapore, May 2008

W.-T. Liu, C.-H. Tsai, T.-W. Han, and T.-L. Wu, “An embedded common-mode suppression filter for GHz differential signals using periodic defected ground plane,” IEEE Trans. Microw. Compon. Lett., vol. 18, no. 4, pp. 248-250, Apr. 2008

P.-J. Cheng, T.-L. Wu, S.-W. Shaw, H.-Y. Chueh, C.-T. Lin, J.-J. Hsu, T.-T. Hsieh, and Y.-K. Soong, “Anxiety levels in women undergoing prenatal maternal serum screening for down syndrome: the effect of a fast reporting system by mobile phone short-message service,” Prenat. Diagn., vol. 28, pp. 417-421, Apr. 2008

T.-K. Wang, S.-T. Chen, C.-W. Tsai, S.-M. Wu, J. J. Drewniak, and T.-L. Wu, “Modeling noise coupling between package and PCB power/ground planes with an efficient 2D-FDTD/lumped element method,” IEEE Trans. Adv. Packag., vol. 30, no. 4, pp. 864-871, Nov. 2007

T.-K. Wang, T.-W. Han, and T.-L. Wu, “A novel EBG power plane with stopband enhancement using artificial substrate,” in Proc. Elect. Performance Electron. Packag. Systems, pp. 193-196, Atlanta, Georgia, USA, Aug. 2007

Y.-C. Chen, T.-K. Wang, S.-M. Lan, C.-H. Lu, and T.-L. Wu, “Broadband noise suppression using a hybrid photonic crystal power/ground plane substrate,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 1-4, Honolulu, Hawaii, USA, Jul. 2007

Tzong-Lin Wu, “Power Integrity and EMC Design for High-speed Computer Packages,” 5th International Symposium on Electromagnetic Environment Technology, Seoul, Korea, June, 2007. (**Keynote speaker**)