Chia-Hsin Chao and Tzong-Lin Wu, “Photonic Crystal Fiber Analysis Through Vector Boundary-Element Method,” The 5th Pacific Rim Conference Lasers and Electro-Optics(CLEO/PR2003), Vol. 2, pp. 100, Taipei, Dec. 2003
DownloadT.-L. Wu, and C.-H. Chao, “3D Electromagnetic Modeling of Polarization-Dependent Coupling Characteristics of 1x3 Linear Array Weakly Fused Fiber Couplers,” Fiber and Integrated Optics, vol. 22, no. 6, pp. 415-432, Nov. 2003.
DownloadChia-Hsin Chao and Tzong-Lin Wu, “Polarization and Dispersion Analysis of Holey Fibers with Elliptical Air Holes through the Vector Boundary-Element Method,” 16th Annual Lasers and Electro Optics Society Meeting(LEOS 2003), Vol. 2, pp. 900-902, Tucson, USA, Oct. 2003
DownloadSin-Ting Chen, Chih-Wei Tsai, Sung-Mao Wu, Chih-Pin Hung and Tzong-Lin Wu, “Coupling Effect of Ground Bounce Noise for Ball Grid Array (BGA) package mounted on Printed Circuit Boards (PCB),” 2003 Taiwan EMC Conference, Vol. 1, pp. 64-68, Oct. 2003
DownloadW.-H. Cheng, T.-L. Wu and W.-S. Jou, “Electromagnetic Shielding of Plastic Packaging in Cost-Effective Optical Transceiver Modules,” 16th Annual Lasers and Electro Optics Society Meeting(LEOS 2003), Vol. 2, pp. 565-566, Tucson, USA, Oct. 2003
DownloadT.-L. Wu, and H.-J. Ou, “A Vector Power Coupling Model for Analyzing Polarization Dependent Loss (PDL) of Equilateral Triangular 3x3 Weakly Fused Fiber Couplers,” Optics Communications, vol. 224, pp. 81-88, Aug. 2003.
DownloadT.-L. Wu, C.-C. Kuo , H.-C. Chang, and J.-S. Shie, “A Novel Systematic Approach for Equivalent Model Extraction of Embedded High-Speed Interconnects in Time Domain,” IEEE Trans. Electromagn. Compat., vol. 45, no. 3, pp. 493-501, Aug. 2003.
DownloadT.-L. Wu, W.-S. Jou, S.-G. Dai, and W.-H. Cheng, “Effective Electromagnetic Shielding of Plastic Packaging in Low-cost Optical Transceiver Modules,” IEEE/OSA Journal of Lightwave Technology, vol. 21, no. 6, pp. 1536-1543, Jun. 2003.
DownloadChun-Chin Kuo and Tzong-Lin Wu,, “ Time-Domain SPICE Model for Coupled Interconnects Using the Multi-Conductor Layer Peeling Technique,” 15th Internation Zurich Symposium & Techncal Exhibition on EMC 2003, Vol. 1, pp. 5-10, Feb. 2003
DownloadHsiao-Chen Chang and Chun-Chin Kuo and Tzong-Lin Wu, “A time-domain approach to extract SPICE-compatible equivalent models for embedded interconnects,” 2002 IEEE EMC Symposium, Vol. 2, pp. 834 -839, ,Minnesota,USA, Aug. 2002
DownloadLi-Rung Chen and Yen-Hui Lin and Tzong-Lin Wu, “NSTL evaluation of the compact EMC chamber with ferrite tiles being partially lined on the floor ground,” 2002 IEEE EMC Symposium, Vol. 2, pp. 958 -963, Minnesota,USA, Aug. 2002
DownloadJiunn-Nan Hwang and Tzong-Lin Wu, “Coupling of the ground bounce noise to the signal trace with via transition in partitioned power bus of PCB,” 2002 IEEE EMC Symposium, Vol. 2, pp. 733 -736, Minnesota,USA, Aug. 2002
DownloadW.-S. Jou, T.-L. Wu, S.-K. Chiu, and W.-H. Cheng, “The Influence of Fiber Orientation on Electromagnetic Shielding in Liquid Crystal Polymers,” IEEE/TMS Journal of Electronic Materials, vol. 31, no. 3, pp. 178-184, Mar. 2002.
DownloadT.-L. Wu, Y.-H. Lin, J.-N. Huang, and J.-J. Lin, “The Effect of Test System Impedance on Measurements of Ground Bounce in Printed Circuit Boards,” IEEE Trans. Electromagn. Compat., vol. 43, no. 4, pp. 600-607, Nov. 2001.
DownloadLi-Rung Chen and Yen-Hui Lin and Tzong-Lin Wu, “NSTL Evaluation of the Compact EMC Chamber with Absorbers Being Partially Lined on the Floor Ground,” 2001 EMC Conference, pp. 343-345, ,Taipei, Taiwan, Oct. 2001
DownloadW.-S. Jou, T.-L. Wu, S.-K. Chiu, and W.-H. Cheng, “Electromagnetic Shielding of Nylon-66 Composites Applied to Laser Modules,” IEEE/TMS Journal of Electronic Materials, vol. 30, no. 10, pp. 1287-1293, 2001.
DownloadY. H. Lin and T. L. Wu, “Investigation of Signal Quality and Radiated Emission of Microstrip Line on Imperfect Ground Plane: FDTD Analysis and Measurement,” 2001 IEEE EMC Symposium, Vol. 1, pp. 319 -324, Montreal, Canada, Aug. 2001
DownloadJ. N. Hwang and T. L. Wu, “The Bridging Effect of the Isolation Moat on the EMI Caused by Ground Bounce Noise between Power/Ground planes of PCB,” 2001 IEEE EMC Symposium, Vol. 1, pp. 471 -474, Montreal, Canada, Aug. 2001
DownloadC. C. Kuo , Y. H. Lin and T. L. Wu, “Crosstalk Characterization of High-Speed Interconnects in Time-Domain,” 2001 IEEE EMC Symposium, Vol. 1, pp. 657 -660, Montreal, Canada, Aug. 2001
DownloadS. K. Chiu, J. Y. Cheng, W. S. Jou, S. C. Wang, C. M. Wang, C. S. Lin, T. L. Wu, and W. H. Cheng, “Electromagnetic Shielding of Plastic Packaging in Laser Diode Modules,” 2001 Electronic Components & Technology Conference, Florida, USA, May 2001
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