Journal

C. -Y. Liu, H. -E. Ding, S. -H. Wu and T. -L. Wu, "Extremely Low-Loss Planar Transition From Hollow Dielectric Waveguide to Printed Circuit Board for Millimeter-Wave Interconnect," IEEE Trans. Microw. Theory Techn., vol. 69, no. 9, pp. 4010-4020, Sep. 2021.

C.-C. Chou and T.-L. Wu, "Poles and Stability of Full-Wave PEEC," IEEE Trans. Antennas Propag., vol. 69, no. 2, pp. 950-961, Feb. 2021.

C.-Y. Liu, H.-E. Ding, S.-H. Wu and T.-L. Wu, "Significant Crosstalk Reduction in High-Density Hollow Dielectric Waveguides by Photonic Crystal Fence," IEEE Trans. Microw. Theory Techn., vol. 69, no. 2, pp. 1316-1326, Feb. 2021.

P.-S. Wei, C.-N. Chiu, C.-C. Chou and T.-L. Wu, "Miniaturized Dual-Band FSS Suitable for Curved Surface Application," IEEE Antennas Wireless Propag. Lett., vol. 19, no. 12, pp. 2265-2269, Dec. 2020.

S. Chen and T.-L. Wu, "A Fully Integrated Arbitrary Power Divider on Printed Circuit Board by a Novel SMD-Resistor-Free Isolation Network," IEEE Trans. Compon. Packag. Manuf. Technol.. , vol. 10, no. 11, pp. 1889-1901, Nov. 2020.

T.-Y. Lin and T.-L. Wu, "Balanced Bandpass Filter With Common-Mode Reflectionless Feature by Terminated Coupled Lines," IEEE Trans. Electromagn. Compat., vol. 62, no. 4, pp. 1090-1097, Aug. 2020.

P.-J. Li and T.-L. Wu, "A Novel Circuit Architecture of Bidirectional Common-Mode Noise Absorption Circuit," IEEE Trans. Microw. Theory Techn., vol. 68, no. 4, pp. 1476-1486, April 2020.

P.-S. Wei, C.-N. Chiu, and T.-L. Wu, "Design and Analysis of an Ultraminiaturized Frequency Selective Surface With Two Arbitrary Stopbands," in IEEE Trans. Electromagn. Compat., vol. 61, no. 5, pp. 1447-1456, Oct. 2019.

C.-K. Chan and T.-L. Wu, "A High-Performance Common-Mode Noise Absorption Circuit Based on Phase Modification Technique," in IEEE Trans. Microw. Theory Techn., vol. 67, no. 11, pp. 4394-4403, Nov. 2019.

Y.-C. Huang, C.-H. Cheng, and T.-L. Wu, "A Synthesized Method for Common-Mode Noise Suppression Filters With Specified Common-Mode and Differential Mode Response," IEEE Trans. Electromagn. Compat., vol. 61, no. 3, pp. 893-902, June 2019.

T.-Y. Lin, Y.-C. Huang, and T.-L. Wu, "Novel Absorptive Balanced Bandpass Filters Using Resistive Loaded Transmission Lines," IEEE Trans. Compon. Packag. Manuf. Technol., vol. 9, no. 4, pp. 745-753, April 2019.

C.-K. Chan, C.-H. Cheng, and T.-L. Wu, "Design of a Broadband Common-Mode Filter With Four Transmission Zeros," IEEE Trans. Electromagn. Compat., vol. 61, no. 4, pp. 1052-1060, Aug. 2019.

C.-C. Chou, S.-S. Weng, Y.-C. Lu, and T.-L. Wu, "EMI-Reduction Coding Based on 8b/10b," IEEE Trans. Electromagn. Compat., vol. 61, no. 4, pp. 1007-1014, Aug. 2019.

P.-J. Li and T.-L. Wu, "Synthesized Method of Dual-Band Common-Mode Noise Absorption Circuits," IEEE Trans. Microw. Theory Techn., vol. 67, no. 4, pp. 1392-1401, April 2019.

C.-H. Cheng and T.-L. Wu, "Analysis and Design Method of a Novel Absorptive Common-Mode Filter," IEEE Trans. Microw. Theory Techn., vol. 67, no. 5, pp. 1826-1835, May 2019.

C.-C. Chou and T.-L. Wu, "Direct Simulation of the Full-Wave Partial Element Equivalent Circuit Using Standard SPICE [Application Notes]," IEEE Microw. Mag., vol. 20, no. 6, pp. 22-34, June 2019.

S. Chen, W.-C. Lee, and T.-L. Wu, "A Resistor-Free $N$ -Way Power Divider With Simultaneous Output Matching and Isolation," IEEE Microw. Wireless Compon. Lett., vol. 29, no. 8, pp. 523-525, Aug. 2019.

S. Chen, W.-C. Lee and T.-L. Wu, "Balanced-to-Balanced and Balanced-to-Unbalanced Power Dividers With Ultra-Wideband Common-Mode Rejection and Absorption Based on Mode-Conversion Approach," in IEEE Trans. Compon. Packag. Manuf. Technol., vol. 9, no. 2, pp. 306-316, Feb. 2019.

C.-W. Lin, C.-K. Shen, C.-N. Chiu and T.-L. Wu, "Design and Modeling of a Compact Partially Transmissible Resistor-Free Absorptive Frequency Selective Surface for Wi-Fi Applications," in IEEE Trans. Antennas Propag., vol. 67, no. 2, pp. 1306-1311, Feb. 2019.

P.-S. Wei, M.-H. Tsai, S.-K. Hsu, C.-K. Shen and T.-L. Wu, "An Electromagnetic Bandgap Structure Integrated With RF LNA Using Integrated Fan-Out Wafer-Level Package for Gigahertz Noise Suppression," in IEEE Trans. Microw. Theory Techn., vol. 66, no. 12, pp. 5482-5490, Dec. 2018.