Publications

Y.-H. Chang, C.-H. Hsieh, S.-P. Cheng, Y. Li, S.S., T. -L. Wu and Z.-M. Tsai, "A 0.6-dB Low Loss and 3-165 GHz Wideband Phase Difference Sub-THz Coupler in 0.18-μm CMOS," IEEE Microw. Wirel. Compon. Lett., vol. 32, no. 6, pp. 531-534, Jun. 2022.

H.-W. Liu, C.-H. Cheng and T. -L. Wu, "A Compact Symmetrical Single-Cell Bidirectional Absorption Common-Mode Filter," IEEE Trans. Compon. Packag. Manuf. Technol., vol. 12, no. 4, pp. 655-664, Apr. 2022.

L. -C. Huang, C.-H. Cheng, S. Chen and T. -L. Wu, "A Novel Absorptive Power Delivery Network for Power Noise Mitigation," IEEE Trans. Electromagn. Compat., vol. 64, no. 2, pp. 536-542, Apr. 2022.

H. -W. Liu, C.-H. Cheng, P. -J. Li and T. -L. Wu, "A Novel Compact Single-Stage Absorption Common-Mode Filter," IEEE Trans. Electromagn. Compat., vol. 64, no. 1, pp. 111-118, Feb. 2022.

Y. -T. Chang, K.-Y. Ling and T. -L. Wu, "Wideband Reconfigurable Power Divider/Combiner in 40-nm CMOS for 5G mmW Beamforming System," IEEE Trans. Microw. Theory Techn., vol. 70, no. 2, pp. 1410-1422, Feb. 2022.

Y.-C. Chien, H-W. Liu and T.-L. Wu, "An Ultrawideband Common-Mode Filter with Cascaded Mushroom-like Structures," 2021 IEEE International Symposium on Radio-Frequency Integration Technology(RFIT), Hualien, Taiwan, Aug. 2021.

S. Chen and T. -L. Wu, "Corrections to “A Fully Integrated Arbitrary Power Divider on Printed Circuit Board by a Novel SMD-Resistor-Free Isolation Network”", IEEE Trans. Compon. Packag. Manuf. Technol., vol.11, no. 9, pp. 1514-1514, Sep. 2021.

C. -Y. Liu, H. -E. Ding, S. -H. Wu and T. -L. Wu, "Extremely Low-Loss Planar Transition From Hollow Dielectric Waveguide to Printed Circuit Board for Millimeter-Wave Interconnect," IEEE Trans. Microw. Theory Techn., vol. 69, no. 9, pp. 4010-4020, Sep. 2021.

Y.-T. Lin, H.-C. Kuo, P.-I Wu, M.-F. Jhong, P.-C. Pan, C.-Y. Liu, C.-C. Wang and T.-L. Wu, "Extraction of Complex Permittivity of Dielectrics on Package from W-Band to D-Band," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, USA, 2021.

C.-C. Chou and T.-L. Wu, "Poles and Stability of Full-Wave PEEC," IEEE Trans. Antennas Propag., vol. 69, no. 2, pp. 950-961, Feb. 2021.

C.-Y. Liu, H.-E. Ding, S.-H. Wu and T.-L. Wu, "Significant Crosstalk Reduction in High-Density Hollow Dielectric Waveguides by Photonic Crystal Fence," IEEE Trans. Microw. Theory Techn., vol. 69, no. 2, pp. 1316-1326, Feb. 2021.

R.-J. Liu, C.-C. Chou and T.-L. Wu, "An Improved Method of Finding Complex Permittivity of Lossy Liquids," 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Shenzhen, China, 2020, pp. 1-3.

P.-S. Wei, C.-N. Chiu, C.-C. Chou and T.-L. Wu, "Miniaturized Dual-Band FSS Suitable for Curved Surface Application," IEEE Antennas Wireless Propag. Lett., vol. 19, no. 12, pp. 2265-2269, Dec. 2020.

S. Chen and T.-L. Wu, "A Fully Integrated Arbitrary Power Divider on Printed Circuit Board by a Novel SMD-Resistor-Free Isolation Network," IEEE Trans. Compon. Packag. Manuf. Technol.. , vol. 10, no. 11, pp. 1889-1901, Nov. 2020.

C.-W. Ting, S. Chen and T.-L. Wu, "A Cost-efficient Air-Filled Substrate Integrated Ridge Waveguide for mmWave Application," 2020 IEEE/MTT-S International Microwave Symposium (IMS), Los Angeles, CA, USA, 2020, pp. 165-168.

C.-K. Chan, T.-M. Wu, M.-L. Wu, G.-J. Fan, C. Shiah, Nicky C. C. Lu and T.-L. Wu, "Power Distribution Network Modeling and Design of Re-Distribution Layer in DDR Application," 2020 IEEE 24th Workshop on Signal and Power Integrity (SPI), Cologne, Germany, 2020, pp. 1-4.

P.-Y. Weng, C.-C. Chou and T.-L. Wu, "EMI Reduction Control Based on 8b/10b," 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA, 2020, pp. 609-613.

T.-Y. Lin and T.-L. Wu, "Balanced Bandpass Filter With Common-Mode Reflectionless Feature by Terminated Coupled Lines," IEEE Trans. Electromagn. Compat., vol. 62, no. 4, pp. 1090-1097, Aug. 2020.

P.-Y. Weng, C.-H. Cheng, T.-L. Wu, Carol Chen, James Chen, Evelyn Kuo, C.-L. Liao and Bhyrav Mutnury , "Improvement of Power and Signal Integrity through Layer Assignment in High-Speed Memory Systems," 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Montreal, QC, Canada, 2019, pp. 1-3.

P.-J. Li and T.-L. Wu, "A Novel Circuit Architecture of Bidirectional Common-Mode Noise Absorption Circuit," IEEE Trans. Microw. Theory Techn., vol. 68, no. 4, pp. 1476-1486, April 2020.