Conference

T.-Y. Lin and T.-L. Wu, “Balanced Bandpass Filter With Reflectionless common-mode Suppression,” IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Honolulu, HI, 2016, pp. 17-19.

C.-W. Lin, C.-K. Shen and T.-L. Wu, “Design and Modeling of an Absorptive Frequency Selective Surface with Several Transmissive Bands,” IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Honolulu, HI, 2016, pp. 33-35.

P.-J. Li, C.-H. Cheng, Y.-C. Tseng, and T.-L. Wu, "Novel Absorptive Design of Common-Mode Filter at Desired Frequency Band," IEEE 20th Workshop on Signal and Power Integrity (SPI), Turin, 2016, pp. 1-4.

Y.-A. Hsu, C.-C. Chou, C.-H. Cheng, and T.-L. Wu, "A Radiation Prediction Method based on Partial Element Equivalent Circuit," Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Shenzhen, 2016, pp. 706-708.

S. Chen, W.-C. Lee, and T.-L. Wu, "A Balanced-to-Balanced Power Divider with Common-Mode Noise Absorption," IEEE MTT-S International Microwave Symposium (IMS), San Francisco, CA, 2016, pp. 1-4.

C.-Y. Liu, C.-K. Shen, S.-Y. Chen, T.-L. Wu, J.-J. Chang, B.-C. Tseng, and J. Yen, "Study of Frequency Offset Behavior for Artificial Magnetic Structure in Compact Mobile Device," IEEE International Symposium on Antennas and Propagation (APSURSI), Fajardo, 2016, pp. 1915-1916.

C.-H. Chen, Y.-C. Tseng, I.-C. Lin, C.-C. Fu, K.-H. Liao, and T.-L. Wu, "Prediction of near-field shielding effectiveness for conformal-shielded SiP and measurement with magnetic probe," IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, California, USA, pp. 77-79, Oct. 2015

W.-Y. Hsu, C.-K. Shen, T.-L. Wu, Ch.-H. Chen, and D.-H. Han, "Post-fabricated EBG Tape on Electronic Devices for RFI Mitigation in WLAN Bands," The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium, Seoul, Korea, Dec. 2015

Y. A. Hsu, C. H. Cheng, Y. C. Lu and T. L. Wu, “A Prediction Method of Heat Generation in the Silicon Substrate for 3-D ICs”, IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),San Jose, California, USA, pp. 89-92, 2015.

C.-H. Cheng, and T.-L. Wu, “Effective Current Distribution Analysis Method for Multiconductor-Transmission-Line (MTL) System with Arbirary Conductor Number Variation,” in Proc. Joint IEEE Int. Symp. Electromag. Compat. and EMC Europe, Dresden, Germany, Aug. 2015

C.-K. Shen, and T.-L. Wu, “Compact Hybrid Open Stub EBG Structure for Power Noise Suppression in WLAN Band,” in Proc. Joint IEEE Int. Symp. Electromag. Compat. and EMC Europe, Dresden, Germany, Aug. 2015

Y.-M. Yu, C.-N. Chiu, Y.-P. Chiou, and T.-L. Wu, “Suppression of End-fired Emission for a Miniaturized-Element Frequency-Selective Shielding Surface with Finite Size Using EBG,” in Proc. IEEE. Int. Symp. Electromagn. Compat., Dresden, Germany, Aug. 2015

Y.-C. Tseng, P.-Y. Weng, and T.-L. Wu, “Compact Wideband Balanced Filter for Eliminating Radio-Frequency Interference on Differentially-fed Antennas,” in Proc. Joint IEEE Int. Symp. Electromag. Compat. and EMC Europe, Dresden, Germany, Aug. 2015

Y.-M. Yu and T.-L. Wu, “A Via-Based Methodology for Frequency Selective Surface Minimization,” in Proc. IEEE Int. Symp. Antennas Propag., Vancouver , Canada, Jul. 2015

C.-K. Shen, M.-H. Tsai, H.-N. Chen, C.-P. Jou, Sally Liu, F.-L. Hsueh, and T.-L. Wu, “Design of On-Chip Microwave Filters in Integrated Fan-Out Wafer Level Packaging (InFO-WLP) Technology,” in Proc. Asia-Pacific Int. Symp. Electronmagn. Compat., Taipei, Taiwan, May 2015

C.-H. Cheng, and T.-L. Wu, “A Compact Dual-Band Common-Mode Filtering Component for EMC in Wireless Communication,” in Asia-Pacific Symp. Electromagn. Compat., Taipei, Taiwan, May 2015

C.-Y. Lin, Y.-C. Huang, and T.-L. Wu, “Tri-Section Quarter Wavelength Resonator Common Mode Filter,” in Proc. Asia-Pacific Int. Symp. Electronmagn. Compat., Taipei, Taiwan, May 2015

Y.-J. Lin, Y.-C. Tseng, C.-Y. Hsiao and T.-L. Wu, “A SMD-Type Filter Solution for EMI/RFI Mitigation on High-Speed Digital Interfaces and Its Application,” in Asia-Pacific Symp. Electromagn. Compat., Taipei, Taiwan, May 2015

C.-H. Chen, Y.-C. Tseng, I-C. Lin, C.-C. Fu, and T.-L. Wu, “Transmission-Line Based Modeling for Conformal Shielding in Advanced System-in-Package (SiP),” in Asia-Pacific Symp. Electromagn. Compat., Taipei, Taiwan, May 2015

C.-H. Hung, C.-Y. Hsiao, and T.-L. Wu, “A novel common-mode filter (CMF) design based on signal interference technique,” in Proc. IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), pp. 125-128, Bangalore, India, Dec. 2014