Publications

T.-L. Wu, F. Buesink, and F. Canavero, “Overview of signal integrity and EMC design technologies on PCB:fundamentals and latest progress,” IEEE Trans. Electromag. Compat., vol. 55, no. 4, pp. 624 - 638, Aug. 2013.

C.-K. Shen, Y.-C. Lu, Y.-P. Chiou, T.-Y. Cheng, and T.-L. Wu, “Power distribution network modeling for 3-D ICs with TSV arrays,” 18th Asia and South Pacific Design Automation Conference (ASP-DAC), pp. 17-22, Yokohama, Japan, Jan. 2013.

T.-H. Lin, J.-C. Yen, S.-K. Hsu, and T.-L. Wu, “A novel compact 3-dB forward-wave directional coupler with periodic capacitive enhancement,” in Proc. Asia-Pacific Microw. Conf., pp. 983-985, Kaohsiung, Taiwan, Dec. 2012.

J.-H. Lin, H.-P. Chang, T.-L. Wu, and Y.-P. Chiou, “3D simulation of substrate noise coupling from Through Silicon Via (TSV) and noise isolation methods,” in Proc. IEEE Elect. Design Adv. Packag. Systems Symp., pp. 181-184, Taipei, Taiwan, Dec. 2012.

K.-Y. Chen, Y.-A. Sheu, C.-H. Cheng, J.-H. Lin, Y.-P. Chiou, and T.-L. Wu, “A novel TSV model considering nonlinear MOS effect for transient analysis,” in Proc. IEEE Elect. Design Adv. Packag. Systems Symp., pp. 49-52, Taipei, Taiwan, Dec. 2012.

Y.-C. Tseng, C.-B. Chang, C.-K. Tang, C.-H. Cheng, Y.-C. Lu, K.-Y. Lin, T.-L. Wu, and R.-B. Wu, “Design considerations for radio frequency 3DICs,” in Proc. IEEE Elect. Design Adv. Packag. Systems Symp., 2012 IEEE, Taipei,Taiwan, pp.197-200, Dec. 2012.

C.-D. Wang and T.-L. Wu, “Model and mechanism of miniaturized and stopband-enhanced interleaved EBG structure for power/ground noise suppression,” IEEE Trans. Electromag. Compat., vol. 55, no. 1, pp. 159 - 167, Feb. 2013.

C.-C. Chou, H.-H. Chuang, S.-H. Weng, C.-K. Cheng, and T.-L. Wu, “Eye prediction of digital driver with power distribution network noise,” in Proc. IEEE Elect. Performance Electron. Package. Systems, pp. 131-134, Tempe, AZ, Oct. 2012.

Y.-J. Chang, H.-H. Chuang, Y.-C. Lu, Y.-P. Chiou, P.-S. Chen, S.-H. Wu, T.-Y. Kuo, C.-J. Zhan, W.-C. Lo, and T.-L. Wu, “Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: experimental validation and application to faraday cage design,” in Proc. IEEE Elect. Performance Electron. Package. Systems, pp. 232-235, Tempe, AZ, Oct. 2012.

T.-W. Weng and T. -L. Wu, “A novel miniaturized bandstop filter using defected ground on system in package (SiP),” in Proc. IEEE Elect. Performance Electron. Package. Systems, pp. 296-298, Tempe, AZ, Oct. 2012.

Y.-J. Cheng, H.-H. Chuang, and T.-L. Wu, "A Novel Dual-Functional Structure Integrating Differential-Mode Equalizer with Common-Mode Filter for Gbps Signaling," in Proc. IEEE Eur. Electromagn. Compat. Conf., Rome, Italy, Sep. 2012, pp. 1-5.

H.-C. Chen, S.-K. Hsu, T.-C. Chang, W.-C. Chi, S.-Y. Ma, and T.-L. Wu, “Signal integrity design for GHz high-speed differential wires with slip ring capsule,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 18-21, Pittsburgh, PA, Aug. 2012.

C.-H. Huang and T.-L. Wu, "Analytical Design of Via Lattice for Ground Planes Noise Suppression and Application on Embedded Planar EBG Structures,"IEEE Trans. Compon. Packag. Manuf. Technol., vol. 3, no. 1, pp. 21-30, Jan. 2013

J.-C. Yen, S.-K. Hsu, T.-H. Lin, and T.-L. Wu, “A Broadband Forward-Wave Directional Coupler Using Periodic Y-Shaped Ground Via Structures With Arbitrary Coupling Levels,” IEEE Trans. Microw. Theory Techn., vol.61, no.1, pp. 38-47, Jan. 2013.

Y.-J. Chang, T.-Y. Zheng, H.-H. Chuang, C.-D. Wang, P.-S. Chen, T.-Y. Kuo, C.-J. Zhen, S.-H. Wu, W.-C. Lo, Y.-C. Lu, Y.-P. Chiou, and T.-L. Wu, “Low slow-wave effect and crosstalk for low-cost ABF-coated TSVs in 3-D IC interposer,” in Proc. IEEE 62nd Electronic Components and Technology Conf., pp. 1934-1938, San Diego, USA, May-Jun. 2012.

Y.-J. Chang, C.-C. Chou, H.-H. Chuang, and T.-L. Wu, "A new solution and its estimation method for slot-crossing signals to reduce ISI-increased crosstalk," in Asia-Pacific Symp. Electromagn. Compat., pp. 622-626, Singapore, May 2012.

C.-Y. Hsiao, C.-H. Tsai, C.-N. Chiu, T.-L. Wu, "Radiation Suppression for Cable-Attached Packages Utilizing a Compact Embedded Common-Mode Filter",IEEE Trans. Compon. Packag. Manuf. Technol., vol. 2, no. 10, pp. 1696-1703, Oct. 2012.

H.-H. Chuang, C.-C. Chou, Y.-J. Chang, and T.-L. Wu, "A branched reflector technique to reduce crosstalk between slot-crossing signal lines," IEEE Trans. Microw. Compon. Lett., vol. 22, no. 7, pp. 342 - 344, Jul. 2012

H.-C. Chen, C.-H. Tsai, and T.-L. Wu, "A compact and embedded balanced bandpass filter with wideband common-mode suppression on wireless SiP," IEEE Trans. Compon. Packag. Manuf. Technol., vol. 2, no. 6, pp. 1030-1038, Jun. 2012

T.-Y. Cheng, C.-D. Wang, Y.-P. Chiou, and T.-L. Wu, "A new macro-π model for through-silicon vias on 3-D IC using conformal mapping method," IEEE Trans. Microw. Compon. Lett., vol. 22, no. 6, pp. 303 - 305, Jun. 2012