Conference

Y.-T. Chen, Y.-Y. Cheng, and T.-L. Wu," Optimization of TSV Array Based on Mathematical Model for HBM3", 2024 IEEE 33nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Toronto, Canada, Oct. 2024.

L. -Y. Wu, C. -Y. Fang, B. -C. Tseng, Jackson Y. and T. -L. Wu, "Comparison of Radio Frequency Interference (RFI) Issue between Differential and Common Modes in USB Channel" 2024 International Symposium on Electromagnetic Compatibility (EMC Europe), Bruges, Belgium, Sep. 2024.

Y. -Y. Cheng, S. -K. Yang, S. -H. Wu and T. -L. Wu, "The Worst-Case Eye Prediction Algorithm for MIPI C-PHY Signaling on Mobile Artificial Intelligence (AI) Chips" 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA, Aug. 2024.

Y.-R. Chen, Y.-T. Lin and T.-L. Wu, "Comparisons of Equalization Performances and CM Suppression on NRZ and PAM4 Signals using Wideband DME-CMF," 2024 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Okinawa, Japan, May. 2024.

P.-S. Su, L.-C. Huang, L.-C. Wan, P.-H. Tsou and T.-L. Wu, "Accuracy Improvement in Calibration Method for Complex Material Characterization by Coaxial Holder," 2023 Asia-Pacific Microwave Conference (APMC), Taipei, Taiwan, Dec. 2023, pp. 647-649.

L.-H. Huang, Y.-Y. Cheng, and T.-L. Wu,"HBM3 PPA Performance Evaluation by TSV Model with Micro-Bump and Hybrid Bonding", 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Milpitas, CA, USA, 2023, pp. 1-3.

J.-G. Chen, Y.-T. Lin, C.-C. Chou and T.-L. Wu, "Wideband Mutual Coupling Reduction in mm-wave Aperture-coupled Stacked Patch Antenna Arrays using a Novel Mushroom-like Resonator", 2023 XXXVth URSI General Assembly and Scientific Symposium (URSI GASS), Sapporo, Japan, Aug.2023.

H.-W. Liu, and T.-L. Wu, "A Wideband Single-Cell Unidirectional Absorption Common-Mode Filter with Pattern Ground Structure," 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China, May. 2022, pp. 13-15.

Y.-T. Lin, H.-C. Kuo, P.-I Wu, M.-F. Jhong, P.-C. Pan, C.-Y. Liu, C.-C. Wang and T.-L. Wu, "A planar High-efficient W-band Substrate-Integrated-Waveguide Cavity-backed Slot Antenna Array," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, USA, May. 2022, pp. 93-97

Y.-C. Chien, H-W. Liu and T.-L. Wu, "An Ultrawideband Common-Mode Filter with Cascaded Mushroom-like Structures," 2021 IEEE International Symposium on Radio-Frequency Integration Technology(RFIT), Hualien, Taiwan, Aug. 2021.

Y.-T. Lin, H.-C. Kuo, P.-I Wu, M.-F. Jhong, P.-C. Pan, C.-Y. Liu, C.-C. Wang and T.-L. Wu, "Extraction of Complex Permittivity of Dielectrics on Package from W-Band to D-Band," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, USA, 2021.

R.-J. Liu, C.-C. Chou and T.-L. Wu, "An Improved Method of Finding Complex Permittivity of Lossy Liquids," 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Shenzhen, China, 2020, pp. 1-3.

C.-W. Ting, S. Chen and T.-L. Wu, "A Cost-efficient Air-Filled Substrate Integrated Ridge Waveguide for mmWave Application," 2020 IEEE/MTT-S International Microwave Symposium (IMS), Los Angeles, CA, USA, 2020, pp. 165-168.

C.-K. Chan, T.-M. Wu, M.-L. Wu, G.-J. Fan, C. Shiah, Nicky C. C. Lu and T.-L. Wu, "Power Distribution Network Modeling and Design of Re-Distribution Layer in DDR Application," 2020 IEEE 24th Workshop on Signal and Power Integrity (SPI), Cologne, Germany, 2020, pp. 1-4.

P.-Y. Weng, C.-C. Chou and T.-L. Wu, "EMI Reduction Control Based on 8b/10b," 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA, 2020, pp. 609-613.

P.-Y. Weng, C.-H. Cheng, T.-L. Wu, Carol Chen, James Chen, Evelyn Kuo, C.-L. Liao and Bhyrav Mutnury , "Improvement of Power and Signal Integrity through Layer Assignment in High-Speed Memory Systems," 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Montreal, QC, Canada, 2019, pp. 1-3.

C.-W. Ting, K.-C. Chen, S. Chen and T.-L. Wu, "A mm-Wave Low-Loss Transition from Microstrip Line to Air-Filled Substrate Integrated Wavguide on Printed Circuit Board Technology," 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), KAOHSIUNG, Taiwan, 2019, pp. 1-3.

P.-Y. Weng, C.-H. Cheng, T.-L. Wu, C.-H. Chen, James Chen, Evelyn Kuo, C.-L. Liao and Bhyrav Mutnury, "Enhanced Power and Signal Integrity Through Layout Optimization of High-Speed Memory Systems," 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), KAOHSIUNG, Taiwan, 2019, pp. 1-3.

P.-J. Li, C.-C. Chou, and T.-L. Wu, "Modeling of Radiated Emission caused by Coaxial-to-microstrip Transition," 2019 International Conference on Electromagnetics in Advanced Applications (ICEAA), Granada, Spain, 2019, pp. 0245-0249.

H.-W. Liu, C.-H. Cheng, and T.-L. Wu, "Miniaturized Quarter-Wavelength Resonator for Common-Mode Filter Based on Pattern Ground Structure," 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan, 2019, pp. 816-819.