Y.-T. Chen, Y.-Y. Cheng, and T.-L. Wu," Optimization of TSV Array Based on Mathematical Model for HBM3", 2024 IEEE 33nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Toronto, Canada, Oct. 2024.
DownloadL. -Y. Wu, C. -Y. Fang, B. -C. Tseng, Jackson Y. and T. -L. Wu, "Comparison of Radio Frequency Interference (RFI) Issue between Differential and Common Modes in USB Channel" 2024 International Symposium on Electromagnetic Compatibility (EMC Europe), Bruges, Belgium, Sep. 2024.
DownloadY. -Y. Cheng, S. -K. Yang, S. -H. Wu and T. -L. Wu, "The Worst-Case Eye Prediction Algorithm for MIPI C-PHY Signaling on Mobile Artificial Intelligence (AI) Chips" 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), Phoenix, AZ, USA, Aug. 2024.
DownloadY.-Y Cheng, P.-Y. Weng, S.-K. Yang, S.-H. Wu and T.-L. Wu, "Eye Estimation Methods for MIPI C-PHY," IEEE Trans. Signal Power Integrity. vol. 3, pp. 75-84, May 2024.
DownloadY.-R. Chen, Y.-T. Lin and T.-L. Wu, "Comparisons of Equalization Performances and CM Suppression on NRZ and PAM4 Signals using Wideband DME-CMF," 2024 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Okinawa, Japan, May. 2024.
DownloadY.-R. Chen, Y.-T. Lin and T.-L. Wu, "A Novel Compact Dual-Functional Circuit With Differential-Mode Equalization and Broadband Common-Mode Suppression Using Patterned Ground Plane," IEEE Trans. Compon. Packag. Manuf. Technol., vol. 14, no. 2, pp. 300-308, Feb. 2024.
DownloadY.-C. Chien, H. -W. Liu, C. -C. Chou and T. -L. Wu, "An Embedded Common-Mode Filter and Mixed-Mode Scattering Parameters for the MIPI C-PHY Interface," IEEE Trans. Electromagn. Compat.vol. 66, no. 1, pp. 143-152, Feb. 2024
DownloadP.-S. Su, L.-C. Huang, L.-C. Wan, P.-H. Tsou and T.-L. Wu, "Accuracy Improvement in Calibration Method for Complex Material Characterization by Coaxial Holder," 2023 Asia-Pacific Microwave Conference (APMC), Taipei, Taiwan, Dec. 2023, pp. 647-649.
DownloadL.-C. Huang and T.-L. Wu, "Theory-based Contour Plot Analysis for Optimized Power Delivery Network Noise Absorber," IEEE Trans. Signal Power Integrity., vol. 2, pp. 134-144, Oct. 2023.
DownloadL.-H. Huang, Y.-Y. Cheng, and T.-L. Wu,"HBM3 PPA Performance Evaluation by TSV Model with Micro-Bump and Hybrid Bonding", 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Milpitas, CA, USA, 2023, pp. 1-3.
DownloadS. Chen and T. -L. Wu, "A Miniaturized Balanced-to-Balanced Power Divider with Common-Mode Noise Absorption," IEEE Trans. Compon. Packag. Manuf. Technol., vol. 13, no. 10, pp. 1673-1684, Oct. 2023.
DownloadC. -W. Ting, H. -W. Liu, C. -H. Liao, C. -C. Lee and T. -L. Wu, "A Low-Loss Via-Free Ridge Air-Filled Substrate Integrated Waveguide on Printed Circuits Board for mmWave Application," IEEE Trans. Compon. Packag. Manuf. Technol., vol. 13, no. 9, pp. 1451-1460, Sep. 2023.
DownloadJ.-G. Chen, Y.-T. Lin, C.-C. Chou and T.-L. Wu, "Wideband Mutual Coupling Reduction in mm-wave Aperture-coupled Stacked Patch Antenna Arrays using a Novel Mushroom-like Resonator", 2023 XXXVth URSI General Assembly and Scientific Symposium (URSI GASS), Sapporo, Japan, Aug.2023.
DownloadL.-C. Huang and T.-L. Wu, "Design and Analysis of Broadband Power Delivery Network Noise Absorber for Parallel-Plate Mode Suppression," IEEE Trans. Microw. Theory Techn., vol. 71, no. 4, pp. 1677-1686, Apr. 2023.
DownloadP.-Y. Weng, C.-L. Liao, Bhyrav Mutnury and T.-L. Wu, "Optimization of Ground-via Patterns for via Transitions by Minimizing Loop Inductance," IEEE Trans. Signal Power Integrity. vol. 2, pp. 43-52, Mar. 2023.
DownloadH.-W. Liu and T. -L. Wu, "A Novel Patterned Ground Structure With Shunt and Series Lumped Elements for Synthesizing Absorption Common-Mode Filters," IEEE Trans. Electromagn. Compat., vol. 65, no. 1, pp. 195-205, Feb. 2023.
DownloadY.-C. Chien, H.-W. Liu and T.-L. Wu, "Reducing the Number of Measurements of a Multiport Circuit Using Covering Designs and Turán Systems," IEEE Microw. Wireless Technol. Lett., vol. 33, no. 2, pp. 115-117, Feb. 2023.
DownloadC.-Y. Liu and T.-L. Wu, "Vertically Polarized Planar Transition for Hollow-Dielectric-Waveguide-Based 5G/6G High-Speed mm-Wave Interconnect," IEEE Microw. Wireless Technol. Lett., vol. 33, no. 1, pp. 7-10, Jan. 2023.
DownloadH.-W. Liu, and T.-L. Wu, "A Wideband Single-Cell Unidirectional Absorption Common-Mode Filter with Pattern Ground Structure," 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China, May. 2022, pp. 13-15.
DownloadY.-T. Lin, H.-C. Kuo, P.-I Wu, M.-F. Jhong, P.-C. Pan, C.-Y. Liu, C.-C. Wang and T.-L. Wu, "A planar High-efficient W-band Substrate-Integrated-Waveguide Cavity-backed Slot Antenna Array," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, USA, May. 2022, pp. 93-97
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